A1D00117010 - DIP MODULE FOR THE APPLICATION OF FLUX OR ELECTRICALLY CONDUCT IVE ADHESIVE ONTO FLIP CHIP BUM PS OR CSP BALLS. THE MODULE COV ERS 3 FEEDER SLOTS (30MM EACH). THE DIP-MODULE CAN ONLY BE USE D ON THE FOLLOWING PLACEMENT ST ATIONS: SIPLACE F5 HM EX STA TION COMPUTER SOFTWARE VERSION 407.02, SIPLACE S-27 HM EX STA TION COMPUTER SOFTWARE VERSION 505.01, SIPLACE HF/D-SERIE EX S TATION COMPUTER SOFTWARE VERSIO N 505.01. STANDARD 25UM-75UM, SPACER 10UM (00378544-01). |--| A1D00117010 - Quad Industry GmbH
Артикул: A1D00117010
Наименование: DIP MODULE FOR THE APPLICATION OF FLUX OR ELECTRICALLY CONDUCT IVE ADHESIVE ONTO FLIP CHIP BUM PS OR CSP BALLS. THE MODULE COV ERS 3 FEEDER SLOTS (30MM EACH). THE DIP-MODULE CAN ONLY BE USE D ON THE FOLLOWING PLACEMENT ST ATIONS: SIPLACE F5 HM EX STA TION COMPUTER SOFTWARE VERSION 407.02, SIPLACE S-27 HM EX STA TION COMPUTER SOFTWARE VERSION 505.01, SIPLACE HF/D-SERIE EX S TATION COMPUTER SOFTWARE VERSIO N 505.01. STANDARD 25UM-75UM, SPACER 10UM (00378544-01). |--| A1D00117010
Производитель: Siemens
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| Delivery information | | Export Control Regulations | ECCN : N / AL : N | | Delivery Time | 10 Working day/Working days | | Net Weight (kg) | 7,000 Kg | | Product Dimensions (W x L x H) | Not available | | Packaging Dimension | Not available | | Package size unit of measure | Not available | | Quantity Unit | Piece | | Packaging Quantity | 1 |
| Country of origin | Germany |
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