A1D00117010S02 - DIP MODULE FOR THE APPLICATION OF FLUX OR ELECTRICALLY CONDUCT IVEADHESIVE ONTO FLIP CHIP BUMP S OR CSP BALLS. THE MODULE COVE RS 3 FEEDERSLOTS (30MM EACH). T HE DIP-MODULE CAN ONLY BE USED ON THE FOLLOWING PLACEMENT STAT IONS: SIPLACE F5 HM EX STATI ON COMPUTER SOFTWARE VERSION 40 7.02, SIPLACE S-27 HM EX STATI ON COMPUTER SOFTWARE VERSION 50 5.01, SIPLACE HF-SERIE EX STATI ON COMPUTER SOFTWARE VERSION 50 5.01 . |--| A1D00117010S02 - Quad Industry GmbH
Артикул: A1D00117010S02
Наименование: DIP MODULE FOR THE APPLICATION OF FLUX OR ELECTRICALLY CONDUCT IVEADHESIVE ONTO FLIP CHIP BUMP S OR CSP BALLS. THE MODULE COVE RS 3 FEEDERSLOTS (30MM EACH). T HE DIP-MODULE CAN ONLY BE USED ON THE FOLLOWING PLACEMENT STAT IONS: SIPLACE F5 HM EX STATI ON COMPUTER SOFTWARE VERSION 40 7.02, SIPLACE S-27 HM EX STATI ON COMPUTER SOFTWARE VERSION 50 5.01, SIPLACE HF-SERIE EX STATI ON COMPUTER SOFTWARE VERSION 50 5.01 . |--| A1D00117010S02
Производитель: Siemens
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| Delivery information | | Export Control Regulations | ECCN : N / AL : N | | Delivery Time | 10 Working day/Working days | | Net Weight (kg) | 7,000 Kg | | Product Dimensions (W x L x H) | Not available | | Packaging Dimension | Not available | | Package size unit of measure | Not available | | Quantity Unit | Piece | | Packaging Quantity | 1 |
| Country of origin | Germany |
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