A1D00117011 - LINEAR DIP MODULE FOR THE APPLI CATION OF FLUX MATERIALS ON FLI P CHIP BUMPS OR CSP BALLS. THE MODULE COVERS 9 FEEDER SLOTS (1 1.8MM EACH). THE MODULE CAN ONL Y BE USED ON X-MACHINES WITH SW VERSION 604/SIPRO 5.0 OR HIGHE R. THE DIPPING PLATE FOR DEFINI NG THE CUSTOMER SPECIFIC FLUX M ATERIAL THICKNESS HAS TO BE CON FIGURED SEPERATELY. |--| A1D00117011 - Quad Industry GmbH
Артикул: A1D00117011
Наименование: LINEAR DIP MODULE FOR THE APPLI CATION OF FLUX MATERIALS ON FLI P CHIP BUMPS OR CSP BALLS. THE MODULE COVERS 9 FEEDER SLOTS (1 1.8MM EACH). THE MODULE CAN ONL Y BE USED ON X-MACHINES WITH SW VERSION 604/SIPRO 5.0 OR HIGHE R. THE DIPPING PLATE FOR DEFINI NG THE CUSTOMER SPECIFIC FLUX M ATERIAL THICKNESS HAS TO BE CON FIGURED SEPERATELY. |--| A1D00117011
Производитель: Siemens
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| Delivery information | | Export Control Regulations | ECCN : EAR99H / AL : N | | Delivery Time | 10 Working day/Working days | | Net Weight (kg) | 12,500 Kg | | Product Dimensions (W x L x H) | Not available | | Packaging Dimension | Not available | | Package size unit of measure | Not available | | Quantity Unit | Piece | | Packaging Quantity | 1 |
| Country of origin | Germany |
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