A1D00168721 - THE PROCESS OF REFLOW SOLDERING OF ELECTRONIC ASSEMBLIES IS IN FLUENCED BY MANY DIFFERENT PARA METERS (E.G. REFLOW OVEN, BOARD DESIGN, COMPONENT RANGE ...). TO ASSESS THE PROCESS WINDOW FO R GIVEN PROCESS REQUIREMENTS (C YCLE TIME, ATMOSPHERE, LEAD FRE E .) AN EVALUATION PROCEDURE HA S BEEN DEVELOPED. USING A SET O F GENERIC TEST BOARDS THIS PROC EDURE DETERMINES, THE EQUIPMENT S CAPABILITY TO ENSURE A SATISF ACTORY SOLDERING QUALITY. DELIV ERABLES: REPORT, WHICH GIVES DE TAILED INFORMATION REGARDING TH E OVENS CAPABILITIES AND A RATI NG IF THE OVEN FITS THE CUSTOME RS CURRENT AND FUTURE PRODUCT R ANGE. REQUIRED RESOURCES FOR ST |--| A1D00168721 - Quad Industry GmbH